Testing

Test Services

Samsung Foundry's vastly experienced Testing and Packaging Team, already preparing for the sub-half micron era, is dedicated to helping customers get ahead of competition.

Our team offers a fully array of services including wafer probing, packaging, and final testing; and can assist customer with both new production R&D and yield improvement. Both wafer and package testing services are available from Samsung, for memory, logic and mixed-mode products.

These services provide a total testing solution for our customers, from test program development to wafer and package testing. Among the advanced testing procedures implemented at Samsung are automated test data collection for engineering analysis.

  • Wafer Probing
    • Available UV Erase and Laser Repair
    • Provide Wafer Map and Lot Summary
       
  • Package Test (Final Test) : High/Room/Cold Temperature Testing
  • Test Program : Development / Conversion / Optimization
  • Tester Available :
    • Memory Tester:Advantest, Credence Megatest, ...etc.
    • Logic Tester:Credence, HP, LTX Schlumberger ...etc.
    • Mixed Tester:Credence, LTX EPOS, Schlumberger

Assembly Service for quick turn prototypes and high volume plastic assembly through qualified subcontractors. We offer most plastic packages with high quality, short cycle time, and competitive pricing.

 

Test Services

  • Standard
    • DIP (Dual In-line Package)
    • DIPH (DIP with heat sink)
    • SIP (Single In-line Package)
    • SIPH (SIP with heat sink)
    • ZIP (Zigzag In-line Package)
    • ZIPH (ZIP with heat sink)
    • PGA (Pin Grid Array)
  • Shrink type
    • SDIP (Shrink DIP)
    • SDIPH (Shrink DIP with heat sink)
    • SSIP (Shrink SIP)
    • SZIP (Shrink ZIP)
  • Surface Mount Type
  • L-Lead type
    • SVP (Surface Vertical Package)
  • Gull Wing type
    • SHP (Surface Horizontal Package)
    • SOP (Small Outline Package)
    • TSOP (Thin SOP)
    • SSOP (Shrink SOP)
    • SSOPH (SSOP with heat sink)
    • QFP (Quad Flat Package)
    • QFPH (QFP with heat sink)
    • TQFP (Thin QFP)
    • LQFP (Low profile QFP)
  • J-Lead type
    • SOJ (Small Outline J-Lead Package)
    • PLCC (Plastic Leaded Chip Carrier)
  • Ball type
    • BGA (Ball Grid Array)
    • uBGA (Micro BGA)
    • FBGA (Fine Pitch BGA)

 

Other Services

ASIC Design

ASIC IC DesignWe provide system level integration solutions with unified high performance process technology.

Mask Tooling

compassWe provide Real Time WIP Service, Turnkey Solutions, Hot TAT Solutions and Foundry Business Level.

Wafer FAB Fabrication

compassSamsung Foundry makes on-time availability of advanced technologies to meet our customers' plans.

Foundry Services

compassSamsung Foundry is committed to Total Solutions, On-time Delivery, Quick Turn Around Time and High reliability..

Package

compassOur vastly experienced Packaging Team, already preparing for the sub-half micron era, can help you get ahead of competition.

Testing

compassBoth wafer and package testing services are available from Samsung, for memory, logic and mixed-mode products.