Package / Packaging Services

  • Insert Type
    • Standard
      • DIP (Dual In-line Package)
      • DIPH (DIP with heat sink)
      • SIP (Single In-line Package)
      • SIPH (SIP with heat sink)
      • ZIP (Zigzag In-line Package)
      • ZIPH (ZIP with heat sink)
      • PGA (Pin Grid Array)
    • Shrink type
      • SDIP (Shrink DIP)
      • SDIPH (Shrink DIP with heat sink)
      • SSIP (Shrink SIP)
      • SZIP (Shrink ZIP)
    • Surface Mount Type
      • L-Lead type
        • SVP (Surface Vertical Package)
      • Gull Wing type
        • SHP (Surface Horizontal Package)
        • SOP(Small Outline Package)
        • TSOP (Thin SOP)
        • SSOP (Shrink SOP)
        • SSOPH (SSOP with heat sink)
        • QFP (Quad Flat Package)
        • QFPH (QFP with heat sink)
        • TQFP (Thin QFP)
        • LQFP (Low profile QFP)
      • J-Lead type
        • SOJ (Small Outline J-Lead Package)
        • PLCC (Plastic Leaded Chip Carrier)
      • Ball type
        • BGA (Ball Grid Array)
        • uBGA (Micro BGA)
        • FBGA (Fine Pitch BGA)


Other Services

ASIC Design

ASIC IC DesignWe provide system level integration solutions with unified high performance process technology.

Mask Tooling

compassWe provide Real Time WIP Service, Turnkey Solutions, Hot TAT Solutions and Foundry Business Level.

Wafer FAB Fabrication

compassSamsung Foundry makes on-time availability of advanced technologies to meet our customers' plans.

Foundry Services

compassSamsung Foundry is committed to Total Solutions, On-time Delivery, Quick Turn Around Time and High reliability..


compassOur vastly experienced Packaging Team, already preparing for the sub-half micron era, can help you get ahead of competition.


compassBoth wafer and package testing services are available from Samsung, for memory, logic and mixed-mode products.