Package / Packaging Services


Samsung Foundry and ComSOC technology are committed to:

Total Solution

  • Various process Feature Offer Standard CMOS Logic, Programmable Logic , High Voltage , Mask ROM , BiCMOS etc.
  • Front-End Service : Fab Process, Mask Tooling
  • Back-End Service : WF Test, Package, Final Test

Process Porting and Development

  • Modification to SEC Process to meet customer's specific requirement
  • Install a customer developed process in SEC fab.
    Customer Oriented Excellent Service

On-time Delivery and Quick Turn Around time

  • Normal : 2.5 days/layer , Hot : 1.5 days/layer , SuperHot : 1.0 day/layer
  • Process, Test, Product engineering is available to surport customer
  • Logistics Report on WWW : Delivery, WIP, Engineering Information

High Quality and Reliability

  • High Yield and Reliability
  • Process and Operation control for Real time monitoring
  • Qualified by ISO9000, ISO14000


Other Services

ASIC Design

ASIC IC DesignWe provide system level integration solutions with unified high performance process technology.

Mask Tooling

compassWe provide Real Time WIP Service, Turnkey Solutions, Hot TAT Solutions and Foundry Business Level.

Wafer FAB Fabrication

compassSamsung Foundry makes on-time availability of advanced technologies to meet our customers' plans.

Foundry Services

compassSamsung Foundry is committed to Total Solutions, On-time Delivery, Quick Turn Around Time and High reliability..


compassOur vastly experienced Packaging Team, already preparing for the sub-half micron era, can help you get ahead of competition.


compassBoth wafer and package testing services are available from Samsung, for memory, logic and mixed-mode products.