Package / Packaging Services
Samsung Foundry and ComSOC technology are committed to:
Total Solution
- Various process Feature Offer Standard CMOS Logic, Programmable Logic , High Voltage , Mask ROM , BiCMOS etc.
- Front-End Service : Fab Process, Mask Tooling
- Back-End Service : WF Test, Package, Final Test
Process Porting and Development
- Modification to SEC Process to meet customer's specific requirement
- Install a customer developed process in SEC fab.
Customer Oriented Excellent Service
On-time Delivery and Quick Turn Around time
- Normal : 2.5 days/layer , Hot : 1.5 days/layer , SuperHot : 1.0 day/layer
- Process, Test, Product engineering is available to surport customer
- Logistics Report on WWW : Delivery, WIP, Engineering Information
High Quality and Reliability
- High Yield and Reliability
- Process and Operation control for Real time monitoring
- Qualified by ISO9000, ISO14000
Other Services
ASIC Design
We provide system level integration solutions with unified high performance process technology.
Mask Tooling
We provide Real Time WIP Service, Turnkey Solutions, Hot TAT Solutions and Foundry Business Level.
Wafer FAB Fabrication
Samsung Foundry makes on-time availability of advanced technologies to meet our customers' plans.
Foundry Services
Samsung Foundry is committed to Total Solutions, On-time Delivery, Quick Turn Around Time and High reliability..
Package
Our vastly experienced Packaging Team, already preparing for the sub-half micron era, can help you get ahead of competition.
Testing
Both wafer and package testing services are available from Samsung, for memory, logic and mixed-mode products.