Samsung Foundry's vastly experienced Testing and Packaging Team, already preparing for the sub-half micron era, is dedicated to helping customers get ahead of competition. Our team offers a fully array of services including wafer probing, packaging, and final testing; and can assist customer with both new production R&D and yield improvement.

Both wafer and package testing services are available from Samsung, for memory, logic and mixed-mode products. These services provide a total testing solution for our customers, from test program development to wafer and package testing. Among the advanced testing procedures implemented at Samsung are automated test data collection for engineering analysis.

• Wafer Probing

  • Available UV Erase and Laser Repair

  • Provide Wafer Map and Lot Summary
     

• Package Test (Final Test) : High/Room/Cold Temperature Testing

• Test Program : Development / Conversion / Optimization

• Tester Available :

  • Memory Tester:Advantest, Credence Megatest, ...etc.

  • Logic Tester:Credence, HP, LTX Schlumberger ...etc.

  • Mixed Tester:Credence, LTX EPOS, Schlumberger

Assembly Service for quick turn prototypes and high volume plastic assembly through qualified subcontractors. We offer most plastic packages with high quality, short cycle time, and competitive pricing.