Test Services

• Insert Type

   

  • Standard

     

    • DIP (Dual In-line Package)

    • DIPH (DIP with heat sink)

    • SIP (Single In-line Package)

    • SIPH (SIP with heat sink)

    • ZIP (Zigzag In-line Package)

    • ZIPH (ZIP with heat sink)

    • PGA (Pin Grid Array)

     

  • Shrink type

     

    • SDIP (Shrink DIP)

    • SDIPH (Shrink DIP with heat sink)

    • SSIP (Shrink SIP)

    • SZIP (Shrink ZIP)

     

  • Surface Mount Type

     

    • L-Lead type

       

      • SVP (Surface Vertical Package)

       

    • Gull Wing type

       

      • SHP (Surface Horizontal Package)

      • SOP (Small Outline Package)

      • TSOP (Thin SOP)

      • SSOP (Shrink SOP)

      • SSOPH (SSOP with heat sink)

      • QFP (Quad Flat Package)

      • QFPH (QFP with heat sink)

      • TQFP (Thin QFP)

      • LQFP (Low profile QFP)

       

    • J-Lead type

       

      • SOJ (Small Outline J-Lead Package)

      • PLCC (Plastic Leaded Chip Carrier)

       

    • Ball type

       

      • BGA (Ball Grid Array)

      • uBGA (Micro BGA)

      • FBGA (Fine Pitch BGA)